İSTEK, A. .; YIĞITTAP, Özgür .; ÖZLÜSOYLU, İsmail . Effect of chip temperature during bonding on particleboard properties. Maderas. Ciencia y Tecnología, [S. l.], v. 25, p. 1–8, 2023. DOI: 10.4067/s0718-221x2023000100417. Disponível em: https://revistas.ubiobio.cl/index.php/MCT/article/view/5814. Acesso em: 23 nov. 2024.