İstek, Abdullah, Özgür Yiğittap, and İsmail Özlüsoylu. “Effect of Chip Temperature During Bonding on Particleboard Properties”. Maderas-Cienc Tecnol 25 (February 13, 2023): 1–8. Accessed April 25, 2024. https://revistas.ubiobio.cl/index.php/MCT/article/view/5814.