İstek A, Yiğittap Özgür, Özlüsoylu İsmail. Effect of chip temperature during bonding on particleboard properties. Maderas-Cienc Tecnol [Internet]. 2023 Feb. 13 [cited 2024 Apr. 25];25:1-8. Available from: https://revistas.ubiobio.cl/index.php/MCT/article/view/5814