Wettability and decay of particleboards manufactured with thermally treated sugarcane residue and bamboo (Dendrocalamus asper) particles
DOI:
https://doi.org/10.4067/s0718-221x2022000100430Keywords:
Chemical composition, contact angle, medium density particleboards, thermal modification, wood decay fungiAbstract
This study aimed to evaluate the chemical composition of wood particles (control and treated), and the effects of thermal modification and adhesive levels on the wettability and biological resistance of particleboards made of sugarcane residue and bamboo (Dendrocalamus asper). Therefore, 75% bamboo particles and 25% sugarcane residue (bagasse) were used for producing the particleboards. The particles were treated at 220 °C for 3h35min. Urea formaldehyde (UF) adhesive was used in three solid contents (10%, 12% and 14%) based on the dry mass of the particles. The mat was cold pre-consolidated (pressure of 0,5 MPa for 5 min) and after hot consolidated (3,45 MPa, 180 ºC, 10 min). Water and ethylene glycol and two measurement times were used to measure the contact angle. Gloeophyllum trabeum and Rhodonia placenta (brown rot) and Trametes versicolor (white rot) fungi were used for the biological resistance test. There was a change in the chemical composition of the treated particles such as a reduction in the levels of lignin (bagasse and bamboo), total extracts and holocellulose (bagasse). The thermal treatment increased the final contact angles obtained with water. The particleboard surfaces were classified as non-wettable and partially wettable to the tested solvents. The thermal treatment provided biological resistance improvements in the particleboards to the tested fungi, being classified as very resistant to Rhodonia placenta, resistant to very resistant to Gloeophyllum trabeum, and moderate to resistant to Trametes versicolor.
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